PMMA Positive Resists
PMMA (polymethyl methacrylate) is a versatile polymeric material that is well-suited for many imaging and non-imaging microelectronic applications. PMMA resists are simply PMMA polymer dissolved in a solvent like anisole (safe solvent). Exposure causes scission of the polymer chains. PMMA is most commonly used as a high resolution positive resist for direct write e-beam offering extremely high-resolution, ease of handling and excellent film characteristics. PMMA is also used as a protective coating for wafer thinning, as a bonding adhesive and as a sacrificial layer.
Material attributes:
· Positive tone
· E-beam and X-ray imageable
· Wide range of film thicknesses
· Resist developers and strippers
· Excellent adhesion to most substrates
Material uses:
· Wafer thinning
· Protective coatings
· PHEMT
· Multi-layer T-gate processes
· Other direct-write e-beam processes
Copolymer resists are based on a mixture of PMMA and ~8.5% methacrylic acid. Copolymer MMA (8.5) MAA is commonly used in combination with PMMA in bi-layer lift-off resist process where independent control of CD size and shape of each resist layer is required. Standard copolymer resists are formulated in ethyl lactate and are available in a wide range of film thicknesses. All PMMA and copolymer resists are available in package sizes from 500ml to 20 liters.
Material uses:
· Multi-layer T-gate processes
· Other direct write e-beam processes
Material attributes:
· Compatible with multi-layer processes
· Excellent adhesion to most substrates
Schematic of a T-gate illustrating various product layers