UV™ 135 Positive DUV Photoresist
An advanced resist for 130 nm design rules:
· Low iso-dense bias
· Maximum isolated film retention to <110 nm
· Compatible with PSM & OPC assist features to enlarge process windows
Ancillaries:
· AR 3 BARC
· CD-26 Developer
· MF-26 Developer
· Remover 1165
Applications:
· 130 nm device node